| 发明名称 | Method of attaching a light emitting device to a support substrate | ||
| 摘要 | A method according to embodiments of the invention includes providing a wafer of semiconductor light emitting devices, each semiconductor light emitting device including a light emitting layer sandwiched between an n-type region and a p-type region. A wafer of support substrates is provided, each support substrate including a body. The wafer of semiconductor light emitting devices is bonded to the wafer of support substrates. Vias are formed extending through the entire thickness of the body of each support substrate. | ||
| 申请公布号 | US9153758(B2) | 申请公布日期 | 2015.10.06 |
| 申请号 | US201214118564 | 申请日期 | 2012.05.21 |
| 申请人 | Koninklijke Philips N.V. | 发明人 | Steigerwald Daniel Alexander;Bhat Jérôme Chandra;Akram Salman |
| 分类号 | H01L21/00;H01L33/62;H01L33/48;H01L33/50;H01L33/00 | 主分类号 | H01L21/00 |
| 代理机构 | Patent Law Group LLP | 代理人 | Patent Law Group LLP ;Leiterman Rachel V. |
| 主权项 | 1. A method comprising: providing a wafer of semiconductor light emitting devices, each semiconductor light emitting device comprising a light emitting layer sandwiched between an n-type region and a p-type region; providing a wafer of support substrates, each support substrate comprising a body; bonding the wafer of semiconductor light emitting devices to the wafer of support substrates via a bonding layer; and after bonding the wafer of semiconductor light emitting devices to the wafer of support substrates, forming vias extending through the entire thickness of the body of each support substrate and through an entire thickness of the bonding layer. | ||
| 地址 | Eindhoven NL | ||