Chip package and method for forming the same

摘要

An embodiment of the invention provides a chip package which includes: a semiconductor substrate having a first surface and a second surface; a device region disposed in the semiconductor substrate; a dielectric layer disposed on the first surface of the semiconductor substrate; a conducting pad structure disposed in the dielectric layer and electrically connected to the device region, a carrier substrate disposed on the dielectric layer; and a conducting structure disposed in a bottom surface of the carrier substrate and electrically contacting with the conducting pad structure.

主权项

1. A chip package, comprising;
a semiconductor substrate having a first surface and a second surface; a device region disposed in the semiconductor substrate; a dielectric layer disposed on the first surface of the semiconductor substrate; a conducting pad structure disposed in the dielectric layer and electrically connected to the device region, wherein a lower surface of the dielectric layer is a substantially planar surface and completely covers the conducting pad structure; an optical element disposed on the lower surface of the dielectric layer; and a conducting structure disposed on the second surface of the semiconductor substrate and electrically connected to the conducting pad structure, wherein the conducting pad structure is adjacent to an edge of the semiconductor substrate and outside the device region when viewed in a direction orthogonal to the first surface.