发明名称 Chip on film including different wiring pattern, flexible display device including the same, and method of manufacturing flexible display device
摘要 A chip on film for a flexible display device is disclosed. In one aspect, the chip on film includes a base film, a semiconductor chip provided to the base film, and a wire part provided to the base film and electrically connected to the semiconductor chip. The wire part includes a first region and a second region connected to the first region, and a first interval between the wires disposed at an outermost of the first region is different from a second interval between the wires disposed at an outermost area of the second region.
申请公布号 US9153511(B2) 申请公布日期 2015.10.06
申请号 US201314038559 申请日期 2013.09.26
申请人 Samsung Display Co., Ltd. 发明人 Im Dae-Hyuk
分类号 H01L29/08;H01L35/24;H01L51/00;H01L23/12;H01L25/16;H01L25/00;H01L23/14;H01L23/498 主分类号 H01L29/08
代理机构 Knobbe, Martens, Olson & Bear, LLP 代理人 Knobbe, Martens, Olson & Bear, LLP
主权项 1. A chip on film for a flexible display device, comprising: a base film; a semiconductor chip formed over the base film; a wire part formed over the base film and electrically connected to the semiconductor chip; and a protective layer fully covering the semiconductor chip and partially covering the wire part, wherein the wire part includes a first region and a second region connected to the first region, wherein a plurality of wires are formed in each of the first and second regions, wherein a first interval is defined as the distance between two wires that have the greatest distance among the wires located in the first region, wherein a second interval is defined as the distance between two wires that have the greatest distance among the wires located in the second region, and wherein the first interval is different from the second interval.
地址 Gyeonggi-do KR