发明名称 Wafer boat
摘要 A wafer boat for accommodating semiconductor wafers comprises two side rods and at least one back rod, the rods being vertically oriented and extending between a top member and a bottom member. The rods comprise vertically spaced recesses formed at corresponding heights, recesses at the same height defining a wafer accommodation for receiving and supporting a wafer in a substantially horizontal orientation, the recesses having an improved shape. The upwardly facing surfaces of the recesses comprise a first flat surface in an inward region of the recess which is horizontal or inclined upward in an outward direction of the recess and a second flat surface in an outer region of the recess which is inclined downward in an outward direction of the recess. The intersection of the first and second surface forming an edge for supporting the wafer. The recesses are easy to machine and prevent damage to the wafer.
申请公布号 US9153466(B2) 申请公布日期 2015.10.06
申请号 US201313871279 申请日期 2013.04.26
申请人 ASM IP HOLDING B.V. 发明人 Jdira Lucian C.;Klaver Arjen;Boonstra Klaas P.;De Ridder Chris G. M.;Oosterlaken Theodorus G. M.
分类号 H01L21/673 主分类号 H01L21/673
代理机构 Banner & Witcoff, Ltd. 代理人 Banner & Witcoff, Ltd.
主权项 1. A wafer boat comprising two side rods and at least one back rod, the rods extending substantially vertically between a top member and a bottom member, the rods comprising vertically spaced apart recesses formed at corresponding heights, recesses at a same height facing generally inwards and towards each other thereby defining a wafer accommodation for receiving and supporting a wafer in a substantially horizontal orientation, wherein each recess includes a lower, upwardly facing surface comprising a first flat surface in an outward region of the recess which is inclined downward in an outward direction and a second flat surface in an inner region of the recess which is inclined downward in an inward direction, an intersection of the first and second surfaces forming a respective support edge for supporting the wafer, wherein the support edges are substantially horizontal and straight, and wherein the support edges are configured to contact the wafer less than 2 mm away from the wafer edge and wherein each second flat surface in the inner region of the recess is bounded at an inner side thereof by an inner edge that is rounded off.
地址 Almere NL