| 摘要 |
Provided is a substrate processing apparatus. The substrate processing apparatus has: a processing chamber, an air emitting chamber, a load lock chamber, and an exhaust unit. The air emitting chamber emits air inside an object to be treated by decompressing at lower speed than the decompressing speed in the processing chamber, and thereby prevents a warpage phenomenon of a substrate. The air emitting chamber treats air emission for a plurality of objects to be treated at once, and thereby can reduce the process time. |
