发明名称 |
TUNGSTEN FILM FORMING METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND STORAGE MEDIUM |
摘要 |
Provided is a tungsten film deposition method which can perform film deposition in one step without forming an initial tungsten film for nuclear generation. The tungsten film deposition method according to an embodiment of the present invention supplies tungsten chloride gas and reducing gas as a tungsten raw material under decompression atmosphere on a substrate to be treated, reacts tungsten chloride gas and reducing gas by heating the substrate to be treated, and does film deposition a main tungsten film without film depositing an initial tungsten film for nuclear generation. |
申请公布号 |
KR20150111302(A) |
申请公布日期 |
2015.10.05 |
申请号 |
KR20150040022 |
申请日期 |
2015.03.23 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
HOTTA TAKANOBU;AIBA YASUSHI;MAEKAWA KOJI |
分类号 |
H01L21/28;H01L21/324 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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