| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a joining material usable for joining requiring conductivity under an environment where heating is unused, such as an electronic component or an organism hating a stress caused by a heat load; and to provide a joining method.SOLUTION: There are provided galinstan which is a eutectic alloy of gallium (Ga), indium (In) and tin (Sn), and a liquid metal joining material using as a joining material, a liquid alloy forming a metal compound layer on a joining interface by including a specific metal into the composition. A joining method using the liquid metal joining material is also provided.</p> |
