发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To provide a semiconductor device having high withstand voltage.SOLUTION: According to an embodiment, a semiconductor comprises a first semiconductor layer, a first electrode and a second electrode. The first electrode is provided on the first semiconductor layer. The second electrode is provided on the first semiconductor layer and separated from the first electrode in a second direction crossing a first direction from the first semiconductor layer toward the first electrode. the first electrode includes a first electrode layer which contains a first metal and a second electrode layer which is provided between the first electrode layer and the first semiconductor layer and contains a second metal having a melting point lower than that of the first metal. A first distance between the first electrode layer and the second electrode along the second direction is shorter than a distance between the second electrode layer and the second electrode along the second direction.</p>
申请公布号 JP2015177055(A) 申请公布日期 2015.10.05
申请号 JP20140052674 申请日期 2014.03.14
申请人 TOSHIBA CORP 发明人 MOTAI TAKAKO
分类号 H01L21/338;H01L21/28;H01L21/336;H01L21/337;H01L29/41;H01L29/778;H01L29/78;H01L29/786;H01L29/808;H01L29/812 主分类号 H01L21/338
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