| 摘要 |
<p>PROBLEM TO BE SOLVED: To ensure a sufficient operation in a millimeter wave band while maintaining the strength of a high frequency package.SOLUTION: An outer edge of a conductor plate 67 in an X-axis direction protrudes from an outer edge of a circuit board 41 in a Z-axis direction. A circuit board 61A including a terminal electrode 62 connecting a conductor pattern 31 and a conductor pattern 51 forming an input line is disposed over a top face of the conductor plate 67 and a top face of a base substrate 21. A circuit board 61B including a terminal electrode 62 connecting a conductor pattern 52 and a conductor pattern 32 forming an output line is similarly disposed over the top face of the conductor plate 67 and the top face of the base substrate 21. Bottom faces of the circuit boards 61A and 61B are metallized, such that a high frequency signal passing the terminal electrode 62 is prevented from being influenced by a gap between the conductor plate 67 and the base substrate 21.</p> |
