| 摘要 |
<p>PROBLEM TO BE SOLVED: To achieve reduction in size and weight of a resin component having a surface including a three-dimensional circuit formed thereon.SOLUTION: A resin component having a surface including a three-dimensional circuit formed thereon has a first site including a first thermoplastic resin and metal fine particles, a second site including a second thermoplastic resin, and a plating film formed on a surface of the first site, the plating film forming the three-dimensional circuit.</p> |
