SEMICONDUCTOR PACKAGING SUBSTRATE AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGING SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor packaging substrate having a structure excellent in the miniaturization of a wiring pattern and productivity, in the miniaturization of the outermost layer wiring pattern of a semiconductor packaging substrate, and to provide a semiconductor packaging substrate.SOLUTION: In a semiconductor packaging substrate 100 consisting of a multilayer wiring board manufactured using a build-up process, via holes 3, 10 other than the outermost layer are subjected to field plating, a via hole 14 of the outermost layer is not subjected to field plating, and the via hole of the outermost layer is filled with a solder so as to electrically connect a conductor circuit 16 of the outermost layer and an underlying conductor circuit.