| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a plasma processing apparatus in which adhesion of foreign matters to a processed substrate can be reduced.SOLUTION: A plasma processing apparatus has a processing chamber 103 for processing a processed substrate by using plasma, a transfer chamber 105 connected with the processing chamber, a passage connecting the processing chamber and transfer chamber, and a detachable cover arranged in the passage. The cover has more than one split structure, where one split cover 302 covers the inner wall of the passage, and the other cover 303 seals the passage on the transfer chamber side.</p> |
