发明名称 SOLID STATE IMAGE PICKUP DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a solid state image pickup device capable of allowing a light beam to enter a light-receiving part and a color filter part at a desired angle.SOLUTION: The solid state image pickup device includes: a semiconductor substrate having a light-receiving part; a spectroscopic part; a first reflective layer; a transparent support layer; and a second reflective layer. The spectroscopic part is formed on the light-receiving part on a first plane of the semiconductor substrate, and transmits light of a predetermined wavelength band. The first reflective layer has a curved part formed on the spectroscopic part. The support layer is formed on the surface of the curved part of the first reflective layer. The second reflective layer is formed on the support layer.</p>
申请公布号 JP2015176988(A) 申请公布日期 2015.10.05
申请号 JP20140051712 申请日期 2014.03.14
申请人 TOSHIBA CORP 发明人 UENO SOICHIRO
分类号 H01L27/14 主分类号 H01L27/14
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