摘要 |
<p>PROBLEM TO BE SOLVED: To provide a solid state image pickup device capable of allowing a light beam to enter a light-receiving part and a color filter part at a desired angle.SOLUTION: The solid state image pickup device includes: a semiconductor substrate having a light-receiving part; a spectroscopic part; a first reflective layer; a transparent support layer; and a second reflective layer. The spectroscopic part is formed on the light-receiving part on a first plane of the semiconductor substrate, and transmits light of a predetermined wavelength band. The first reflective layer has a curved part formed on the spectroscopic part. The support layer is formed on the surface of the curved part of the first reflective layer. The second reflective layer is formed on the support layer.</p> |