| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board capable of forming the interconnection lines to an electronic component to be mounted with high density, while enhancing the mounting reliability.SOLUTION: A printed wiring board includes first high pads 58CP for connecting an upper substrate, and third low pads 48P for connecting an IC chip. Since the height of the third pad 48P (total thickness t4 of a second conductor layer 38, a second insulating layer 40, and a third conductor layer 48) is thinner than the height of the first pad 58CP (thickness t1 of the first conductor layer 58C), the second conductor layer and third conductor layer are thin. The second conductor layer and third conductor layer constituting the wiring of an IC chip can thereby be formed in fine pitch. |
