| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling device capable of corresponding to a variety of arrangements of high heat generating electronic components.SOLUTION: A cooling device 1 is configured by: a container 2 configured by an outer edge 2a and a bottom surface 4; and a cover unit 3 configured by a plurality of fins 7 having a step 7a, a cover 8 in which a slit 9 for penetrating the plurality of fins 7 is provided in parallel with a long side on one end side of the long side, a plate 10 in which a slit 11 is provided for further penetrating the plurality of fins 7 which have penetrated the cover 8 and a spacer 12 (spacer A12a, spacer B12b) which is provided on the whole periphery in the plate 10 and which holds an interval between the cover 8 and the plate 10. In the container 2, the bottom surface 4 comprises an opening surface 5 and a heat receiving surface 6. A plurality of protrusions 6a are provided at a screwing position corresponding to the arrangement of high heat generating components 20, which are cooling objects, at the heat receiving surface 6. The spacer A12a has a U-shape, and a plurality of grooves 13 in which a refrigerant passes are provided in the spacer B12b. |
