| 摘要 |
PROBLEM TO BE SOLVED: To provide a power module having high reliability and heat dissipation performance in a power module bonded by using a sintering metal bonding material.SOLUTION: In a power module 7 which includes an insulating substrate 1 having conductive layers 2 on both surfaces of an insulation layer and a semiconductor element 5 bonded to the conductor layer by a bonding material, a part corresponding to a peripheral part 5b of the semiconductor element is bonded by a bonding material having low Young's modulus and the central part 5a of the semiconductor element is bonded by a sintering metal bonding material 11A. |
