发明名称 MULTILAYER ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a multilayer electronic component and a manufacturing method therefor.SOLUTION: A multilayer electronic component includes a plurality of metal magnetic material layers, an internal conductor formation layer including an internal coil pattern and a negative printing part formed on the metal magnetic material layer, and upper and lower cover layers formed above and below an active part including the plurality of metal magnetic material layers and internal conductor formation layer. The upper and lower cover layers contain metal magnetic particles having a grain size of 8-25 μm, the negative printing part contains metal magnetic particles having a grain size of 5-15 μm, and the metal magnetic material layer of the active part contains metal magnetic particles having a grain size of 1-10 μm.
申请公布号 JP2015177185(A) 申请公布日期 2015.10.05
申请号 JP20140106864 申请日期 2014.05.23
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 CHEON MIN KYOUNG;CHOI YU JIN;KIM MYEONG GI
分类号 H01F17/04;H01F1/24;H01F17/00;H01F41/04 主分类号 H01F17/04
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