发明名称 METHOD FOR METAL-PLATING RESIN MOLDING
摘要 <p>PROBLEM TO BE SOLVED: To provide a method for forming a fine metal pattern capable of corresponding to even an electric circuit by electroless plating while using a general-purpose resin material without increasing a manufacturing cost.SOLUTION: A method for forming a pattern 10 formed by metal-plating (10c-10e) a surface 2 of a resin molding 1 comprises: a foam roughening step s2 of irradiating the surface of the resin molding with a laser beam so as to draw the pattern to form a portion irradiated by the laser beam in the resin molding into a porous state; a plating coating material application step s3 of selectively applying a plating coating material to the portion formed into a porous state; and a plating step (s6-s8) of forming a metal plating layer having one or more layers in the portion formed into a porous state and applied with the plating coating material by electroless plating.</p>
申请公布号 JP2015175038(A) 申请公布日期 2015.10.05
申请号 JP20140053217 申请日期 2014.03.17
申请人 YOSHIDA TECHNOWORKS CO LTD;REGULUS CO LTD 发明人 MAKINO YUTAKA
分类号 C23C18/22;H05K3/18 主分类号 C23C18/22
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