| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an ultrasonic chamfering machine in which any type of grindstone can be used without replacing ultrasonic excitation means in chamfering processing of an outer peripheral part of a workpiece using ultrasonic vibration.SOLUTION: Chamfering processing of an outer peripheral part of a wafer W is performed by bringing the outer peripheral part of the wafer W into contact with a ground groove 110 of a rotating grindstone 108 while rotating the wafer W sucked and held by a suction table 10 around aθaxis. At this time, the chamfering processing is performed while vibrating the wafer W in aθaxis direction by adding ultrasonic vibration to the wafer W by ultrasonic excitation means built in aθaxis shaft 98.</p> |
