| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a laser processing device and a laser processing method capable of obtaining a desired profile suitable for the processing, by minimum required diffractive optical elements.SOLUTION: A laser beam L1 emitted from a laser oscillator 1 is positioned by a movement unit 3 so as to be on one minute diffraction pattern or over two or more minute diffraction patterns, of at least two or more minute diffraction patterns provided at a diffractive optical element 2. A laser beam L2 given a desired beam profile is reflected by a scan unit 4 at such an angle as to be radiated to a target position on a workpiece 6, and the laser beam L2 is transmitted through a lens unit 5 of which a position in a Z axis direction is controlled so that a focal point of the lens unit 5 coincides with a surface of the workpiece 6. The workpiece is irradiated with a laser beam L3 with the desired laser beam profile, having been focused by the lens unit, and the desired processing is executed.</p> |
