| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology capable of improving production yield of a molded product.SOLUTION: A film F is supplied to a die surface of a resin mold die 10. The film F is then brought into close contact with the die surface, and the film F is separated from the die surface in a corner part 13a of a mold cavity recess 13. Then, the film F is clamped by closing the die. Subsequently, a resin R loaded in the mold cavity recess 13 is subjected to thermal curing with the film F interposed therebetween, while bringing the film F into close contact with the corner part 13a. |
