| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which enables formation of a hardened product excellent in adhesion strength, storage stability, elastic modulus and impact resistance while securing hardenability at low temperatures.SOLUTION: A thermosetting resin composition comprises an epoxy resin having two or more epoxy groups, a phenol resin (P) having a viscosity at 25°C of 1-100,000 mPa s, an amine adduct (A) and a low molecular amine compound (B) having an acid dissociation equilibrium constant (pKa value) of 3-12.</p> |
