发明名称 PLATED ELECTRICAL CONTACTS FOR SOLAR MODULES
摘要 The present invention concerns a plating method for manufacturing of electrical contacts on a solar module wherein the wiring between silicon solar cells in a solar module is deposited by electroplating onto a conductive seed. The wiring between individual silicon solar cells comprises wiring reinforcement pillars which improve the reliability of said wiring.
申请公布号 PH12015501573(A1) 申请公布日期 2015.10.05
申请号 PH12015501573 申请日期 2015.07.15
申请人 ATOTECH DEUTSCHLAND GMBH 发明人 VOSS, TORSTEN;LAMPRECHT, SVEN
分类号 H01L23/538;H01L31/05 主分类号 H01L23/538
代理机构 代理人
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