| 摘要 |
<p>An embodiment of the present invention provides a multi-layer circuit board which can solve a problem with impedance discontinuity between patterns connected through a via on a multi-layer circuit board; match impedance between the patterns connected through the via by cutting a side surface of the via and increasing impedance; and match the impedance between the patterns connected through the via by forming unevenness inside the via and reducing the impedance of the via.</p> |
