LASER CAVITY FORMATION FOR EMBEDDED DIES OR COMPONENTS IN SUBSTRATE BUILD-UP LAYERS

摘要

An apparatus including a package substrate including a plurality of layers of conductive material, the package substrate including a cavity; and a device in the cavity, wherein an ultimate layer of the plurality of layers of conductive material defines contacts to contact points of the device. An apparatus including a package substrate comprising a plurality of conductive layers and a silicon bridge die disposed between ones of the plurality of conductive layers and an ultimate layer of the plurality of conductive layers defines contact points to contact points of the silicon bridge die; and a logic die coupled to the contact points of the ultimate layer of the plurality of layers of conductive layers.

主权项

1. An apparatus comprising:
a package substrate comprising a plurality of layers of conductive material; and a silicon bridge die comprising a contact side and a back side, wherein the back side of the silicon bridge die is coupled to the package at an antepenultimate layer of the plurality of layers of conductive material and wherein the silicon bridge die is disposed between a penultimate layer and an ultimate layer of the plurality of layers of conductive material and wherein the contact side oriented in a direction of the ultimate layer of the plurality of layers of conductive material, wherein an ultimate layer of the plurality of layers of conductive material defines contacts to contact points on the device side of the silicon bridge die.