SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

A semiconductor package and manufacturing method thereof are disclosed. The semiconductor package includes a photosensitive conductive layer, a chip and an encapsulant. The photosensitive conductive layer includes at least one electrically conductive portion and at least one insulating portion. The chip is disposed on the photosensitive conduct layer and electrically coupled the least one electrically conductive portion. The encapsulant covers the chip and the photosensitive conductive layer.

主权项

1. A semiconductor for packaging method, comprising:
providing a carrier, the carrier having a first surface and a second surface opposite to the first surface; forming a photosensitive conductive material on the first surface of the carrier; exposing the photosensitive conductive material to form a photosensitive conductive layer, the photosensitive conductive layer comprising at least one electrically conductive portion and at least one insulating portion; disposing a chip on the photosensitive conductive layer; electrically coupling the chip to the at least one electrically conductive portion; forming an encapsulant to cover the chip and time photosensitive conductive layer; and forming at least one conductive via in the carrier, wherein the at least one conductive via is electrically coupled to the at least one electrically conductive portion.