SEMICONDUCTOR DEVICE HAVING LEAD FRAME WITH NOTCHED INNER LEADS

摘要

A semiconductor device is assembled from a lead frame. The device has a semiconductor die mounted on a flag of the lead frame. A mold compound forms a housing that covers the die. Lead fingers surround the die. Each lead finger has an inner lead length that is covered by the housing and an outer lead length that protrudes from the housing. The inner lead length extends from an edge of the housing towards the die. The inner lead length has an intermediate region that has been bent to form a notch. Bond wires electrically connect electrodes of the die to respective inner lead lengths.

主权项

1. A lead frame sheet with an array of lead frames formed therein, each of the lead frames comprising:
a die flag surrounded by a frame; tie bars extending inwardly from the frame and supporting the die flag; dam bars defining an external package housing outline, wherein each of the dam bars is supported by the surrounding frame; and lead fingers each having an inner lead length extending from one of the dam bars towards the die mount and an outer lead length extending from said one of the dam bars away from the die mount and towards the outer frame, wherein the inner lead length has an intermediate region that has been bent to form a notch.