METHOD FOR ALIGNING PATTERNS ON A SUBSTRATE

摘要

A method for aligning a second pattern to a first pattern based on a first alignment structure on a first substrate is disclosed. The alignment structure has a different magnitude of the electrical characteristic than the substrate. A controller controls the relative position of an electrical probe with respect to the substrate to measure the electrical characteristic corresponding at a plurality of positions proximate the substrate. The measured electrical characteristics are used to identify the location of the alignment structure by identifying a difference between the measured electrical characteristic at a pair of the plurality of positions exceeding a predetermined threshold. A second substrate having the second pattern including a second alignment structure formed thereon is aligned to the first substrate by a controller based on the identified locations of the first and second alignment structures.

主权项

1. A method for aligning a second pattern to a first pattern based on a first alignment structure having a location identified by measurements of an electrical characteristic, comprising:
providing a first substrate having the first pattern including the first alignment structure, wherein the first alignment structure has a different magnitude of the electrical characteristic than the first substrate; providing an electrical probe; using a controller to control the relative position of the electrical probe with respect to the first substrate to measure the electrical characteristic corresponding to each of a plurality of positions proximate the first substrate; using a controller to compare the measured electrical characteristic as a function of position of the probe to identify the location of the first alignment structure by identifying a difference between the measured electrical characteristic at a pair of the plurality of positions exceeding a predetermined threshold; providing a second substrate having the second pattern including a second alignment structure formed thereon; using a controller to identify the location of the second alignment structure; and aligning the second substrate to the first substrate using the identified locations of the first and second alignment structures.