| 发明名称 |
SUBSTRATE SEPARATION DEVICE AND SUBSTRATE SEPARATION SYSTEM |
| 摘要 |
There is provided a substrate separation device and method for separating a growth substrate from a laminate structure which includes a support substrate, a semiconductor layer, and the growth substrate. The device includes: a first base which is configured to hold the laminate structure thereon, and includes a first holding unit configured to hold the support substrate defining a bottom surface of the laminate structure and a heating unit configured to heat the laminate structure; and a second base including a second holding unit disposed above the first holding unit and configured to hold the growth substrate defining an upper surface of the laminate structure. |
| 申请公布号 |
US2015279707(A1) |
申请公布日期 |
2015.10.01 |
| 申请号 |
US201414522937 |
申请日期 |
2014.10.24 |
| 申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
SIM Jae In;PARK Gyeong Seon;LIM Kyung Ja;CHOI Seung Woo;KWON O Hak |
| 分类号 |
H01L21/67;H01L21/683 |
主分类号 |
H01L21/67 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A substrate separation device for separating a growth substrate from a laminate structure including a support substrate, a semiconductor layer, and the growth substrate, the substrate separation device comprising:
a first base which is configured to hold the laminate structure thereon, and comprises:
a first holding unit configured to hold the support substrate defining a bottom surface of the laminate structure; anda heating unit configured to heat the laminate structure; and a second base comprising a second holding unit which is disposed above the first holding unit and configured to hold the growth substrate defining an upper surface of the laminate structure. |
| 地址 |
Suwon-si KR |
