发明名称 Solvent-Based Low Temperature Heat Seal Coating
摘要 A low temperature heat seal coating solution which contains an amorphous or semi-crystalline polyester or co-polyester resin, tackifier, anti-blocking agent, and solvent. The coating solution can be applied to a packaging web such as a foil or film by converters using conventional methods such as gravure, rod, slot die, or printing process. The heal seal coating can be sealed to itself or another substrate to manufacture food packaging bags or pharmaceutical blister packaging. The heat seal temperature can be as low as 70° C. under conventional equipment and conditions in the industry.
申请公布号 US2015275032(A1) 申请公布日期 2015.10.01
申请号 US201514668586 申请日期 2015.03.25
申请人 Bostik, Inc. 发明人 Deak Darius K.;Ruppert Thomas Lee;Lo Elaine
分类号 C09D167/02;B05D3/14;B05D3/00 主分类号 C09D167/02
代理机构 代理人
主权项 1. A solvated, heat seal coating mixture to be applied onto a surface of a packaging film or foil, said mixture comprising: a solvent; a heat seal resin comprising an amorphous or semi-crystalline polyester or co-polyester with a glass transition temperature (Tg) between −35° C. and 0° C. and a Ring and Ball Softening Point between 60° C. and 120° C., the heat seal resin being soluble in said solvent; and an anti-block additive; wherein said mixture when coated on a packaging film or foil and dried to form a heat sealable coating enables heat sealing of coated surfaces face-to-face on a form, fill and seal machine at a sealing temperature as low as 70° C.
地址 Wauwatosa WI US