| 发明名称 |
SEALING RESIN COMPOSITION, SEALING FILM, WIRING BOARD, TFT DEVICE, OLED DEVICE, AND LED DEVICE |
| 摘要 |
A sealing resin composition, which coats silver wiring or a laminate including the silver wiring, comprises: a fluorine-based resin (A); and a migration inhibitor (B) having a fluorine content rate of equal to or more than 35 mass % and less than 65 mass %, wherein the mass ratio ((B)/(A)) of the migration inhibitor (B) to the fluorine-based resin (A) is equal to or more than 0.0010 and less than 0.10. |
| 申请公布号 |
US2015275029(A1) |
申请公布日期 |
2015.10.01 |
| 申请号 |
US201514728139 |
申请日期 |
2015.06.02 |
| 申请人 |
FUJIFILM CORPORATION |
发明人 |
MATSUSHITA Yasuaki;OYA Toyohisa;MATSUMURA Tokihiko |
| 分类号 |
C09D137/00;H01L23/10 |
主分类号 |
C09D137/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A sealing resin composition, which coats silver wiring or a laminate including the silver wiring, comprising:
a fluorine-based resin (A); and a migration inhibitor (B) having a fluorine content rate of equal to or more than 35 mass % and less than 65 mass %, wherein the mass ratio ((B)/(A)) of the migration inhibitor (B) to the fluorine-based resin (A) is equal to or more than 0.0010 and less than 0.10. |
| 地址 |
Tokyo JP |
