| 摘要 |
The purpose of the present invention is to reduce, with regards to placement of circuit bodies equipped with a power semiconductor chip on a heat-dissipating body, an increase in volume in screws, springs, and other pressing members in order to reduce the size of a power conversion apparatus. A power conversion apparatus related to the present invention is provided with a circuit body comprising switching elements, base members forming first concave portions and a cooling surface, and wedges inserted into the first concave portions of the base members. The first concave portions of the base members are formed by a base platform part forming the cooling surface, first walls disposed on the surface on the opposite side from the cooling surface, and intermediate portions connecting the first walls and the base platform part. The first walls form insertion spaces for inserting the wedges, and heat-transfer surfaces forming heat-dissipating surfaces and heat transfer paths for the circuit bodies. When the wedges are inserted into the insertion spaces, the intermediate portions undergo plastic deformation so that the first walls are displaced toward the placement directions of the circuit bodies. |
