发明名称 FILM THICKNESS MEASUREMENT DEVICE AND POLISHING DEVICE
摘要 PROBLEM TO BE SOLVED: To improve the versatility of a film thickness measurement device.SOLUTION: A film thickness measurement device includes: a trigger sensor 220; and an eddy current sensor 210. The trigger sensor 220 includes a proximity sensor 222 and a dog 224 and outputs a trigger signal indicating that a polish table 110, which is capable of rotating in clockwise and anticlockwise directions, rotates by 360 degrees. The eddy current sensor 210 measures a film thickness of a polishing object 102 at timing based on the trigger signal output from the trigger sensor 220. The dog 224 is disposed at an opposite region 250 located at the opposite side of a rotary axis Cw of a top ring 116 with respect to a rotary axis Cof the polish table 110. Further, the eddy current sensor 210 and the proximity sensor 222 are disposed at the polishing table 110 so as to be positioned at the opposite region 250 when the trigger signal is output from the trigger sensor 220.
申请公布号 JP2015171744(A) 申请公布日期 2015.10.01
申请号 JP20140048674 申请日期 2014.03.12
申请人 EBARA CORP 发明人 SHINOZAKI HIROYUKI
分类号 B24B49/04;B24B37/013;H01L21/304 主分类号 B24B49/04
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