| 摘要 |
PROBLEM TO BE SOLVED: To provide a vehicle lighting appliance which obtains high heat dissipation performance without increasing thickness of a member for arranging a base board having a semiconductor light emitting element, and can be manufactured by means which is high in productivity such as press molding.SOLUTION: This vehicle lighting appliance comprises: a housing 10 having an opening at a front part; an outer lens 20 attached to the opening; and a light source unit 30 arranged in a lamp chamber which is formed of the housing 10 and the outer lens 20. The light source unit 30 comprises: a base plate 40; a base board 50 having a semiconductor light emitting element 51 arranged on a surface of the base plate 40; and an abutting plate 60 which is arranged on a rear surface of the base plate 40, and arranged at a position which opposes the base board 50 with the base plate 40 sandwiched therebetween. |
