SCREEN CONTROL MODULE OF A MOBILE ELECTRONIC DEVICE AND CONTROLLER THEREOF

摘要

A screen control module of a mobile electronic device has at least one controller formed on a circuit board. The circuit board has multiple solder pads formed on the circuit board and respectively aligning along a first direction and a second direction. A count of the solder pads along the first direction is greater than that along the second direction. The controller is formed by an integrated circuit with a package, and the aspect ratio of the package is not less than 2. The package has multiple electrical contacts respectively aligning along a length direction and a width direction. Each electrical contact aligns with and is electrically connected to a corresponding solder pad. Accordingly, the screen control module mounted within a side frame of a display of the mobile electronic device can increase the aspect ratio to meet the demand for narrowing the side frame of the display.

主权项

1. A screen control module of a mobile electronic device, comprising:
a circuit board having:
a surface of the circuit board has a first area having:
a first central region; anda first outer region formed outside of the first central region; andmultiple solder pads formed in the outer region of the surface and respectively aligning along a first direction and a second direction, wherein the number of the solder pads along the first direction is greater than a count of the solder pads along the second direction; and at least one controller, each one of the at least one controller formed by an integrated circuit having a package on the surface of the circuit board, wherein the package has a length and a width, an aspect ratio between the length and the width of the package is greater than or equal to two, the package has:
a bottom surface having:
a second central region aligning with the first central region; anda second outer region formed outside of the second central region and aligning with the first outer region, wherein all of the electrical contacts are formed on the second outer region; andmultiple electrical contacts formed in the second outer region and respectively aligning along a direction of the length and a direction of the width, and the electrical contacts respectively align with and electrically connecting with the solder pads.