| 发明名称 |
EPOXY RESIN FORMULATION FOR LARGE AND THICK COMPOSITE STRUCTURES |
| 摘要 |
In the present disclosure!, there is disclosed an epoxy resin formulation for the manufacturing of large and thick composite structures, said formulation comprising i) at least one epoxy resin in a weight proportion varying between 50 parts to 70 parts; (ii) at least one hardening agent in a weight proportion varying between 21 phr to 29 phr; (iii) at least one diluent in a weight proportion varying between 10 phr to 40 phr; and (iv) N,N′dimethylaminopropylamine as an accelerator in a weight proportion varying between 0.5 phr to 3.0 phr. The formulation is used in the manufacturing of large and thick composite structures by employing Vacuum Assisted Resin Transfer Molding Process. |
| 申请公布号 |
US2015274902(A1) |
申请公布日期 |
2015.10.01 |
| 申请号 |
US201314431039 |
申请日期 |
2013.03.26 |
| 申请人 |
DIRECTOR GENERAL, DEFENCE RESEARCH & DEVELOP0MENT ORGANIZATION (DRDO) |
发明人 |
Harshe Rahul;Kottot Ranjith;Anand Anoop;Joshi Makarand |
| 分类号 |
C08J5/04;C08G59/24;C08G59/50 |
主分类号 |
C08J5/04 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A thermoset resin formulation for the manufacture of large and thick composite structures; said formulation comprising (i) at least one epoxy resin in a weight proportion varying between 50 parts to 70 parts; (ii) at least one hardening agent in a weight proportion varying between 21 phr to 29 phr; (iii) at least one diluent in a weight proportion varying between 10 phr to 40 phr; and (iv) N,N′dimethylaminopropylamine as an accelerator in a weight proportion varying between 0.5 phr to 3.0 phr. |
| 地址 |
New Delhi IN |
