EPOXY RESIN COMPOSITION, METHOD FOR PRODUCING EPOXY RESIN CURED PRODUCT AND SEMICONDUCTOR DEVICE

摘要

Provided are: an epoxy resin composition which is capable of providing a cured product having excellent heat resistance, thermal decomposition stability and mechanical strength retainability, while exhibiting excellent fluidity during molding and being suitable for power device sealing materials; and a method for producing an epoxy resin cured product. An epoxy resin composition which contains an epoxy resin represented by general formula (1), a phenolic curing agent, a curing catalyst and an inorganic filler, and wherein the exothermic peak top thereof as determined by differential scanning calorimetry at a heating rate of 10°C/minute is 150°C or higher. A method for producing an epoxy resin cured product, wherein this epoxy resin composition is molded at 100-200°C and then is subjected to postcuring at 200-300°C. (In the formula, n represents an average of 0.2-4.0; and G represents a glycidyl group.)