发明名称 EDGE PLATED PRINTED CIRCUIT BOARD
摘要 An edge plated printed circuit board (PCB) 405 improves radiated emission performance by enhancing ground shielding on the PCB and improving the physical and electrical connection between the PCB and external EMI suppression components including an EMI chassis and gaskets. Inner ground layers 910, 925 within a multi-layer PCB are configured to physically extend to an edge 960 of the PCB, which is plated using copper electroplating, so that copper ground strips 980, 985 disposed at the top and bottom surfaces of the PCB and the inner ground layers are all electrically coupled to the plated edge 965. In some embodiments, the ground strips can be made thinner compared to conventional arrangements, or be eliminated altogether as a result of the direct connection between the edge plated PCB and external EMI shields.
申请公布号 WO2015148239(A1) 申请公布日期 2015.10.01
申请号 WO2015US21365 申请日期 2015.03.19
申请人 MICROSOFT TECHNOLOGY LICENSING, LLC 发明人 ATKINSON, PETER;FONG, CHEE;CASEBOLT, MARK;LIANG, YING
分类号 H05K1/02;H05K3/40;H05K9/00 主分类号 H05K1/02
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