| 摘要 |
Provided is a semiconductor device with high reliability by strong bonding with a substrate. An outer lead (5) is electrically connected to an inner lead suspending lead (3) through an inner lead. Therefore, a plating film is formed on an outer lead cut surface (11), and a soldering layer is easily formed on the whole surfaces of the outer lead extended from an encapsulating resin (10). Also, a first throttle part (12a) is formed on the inner lead suspending lead (3). Therefore, damage is suppressed when the inner lead suspending lead is cut. |
