| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wiring board with a bump and a manufacturing method of the same, which improve reliability by ensuring an adhesion strength of the bump on a conductor circuit while reducing the number of processes.SOLUTION: A wiring board with a bump comprises: an insulating base material; conductor circuits arranged on the insulating base material; a stopper metal layer arranged on the conductor circuit to be an etching resist of the conductor circuit; an inter-circuit space provided between the conductor circuits, where the insulating base material is exposed from the conductor circuits and the stopper metal layer; and convex bumps each formed of dissimilar metal layer having etching characteristic different from that of the stopper metal layer. The bumps are arranged on a part of the stopper metal layer and the stopper metal layer has any of gold, silver, palladium and tin alloy.</p> |
