| 发明名称 |
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE CASING |
| 摘要 |
A semiconductor device has an insulating substrate, a semiconductor element which is mounted on the insulating substrate, a hollow casing which surrounds a peripheral edge of the insulating substrate to contain the semiconductor element therein, and a sealing material which is charged into the casing to seal the inside of the casing. The casing has protrusion portions each of which partially protrudes from an upper surface of the casing. Thus, it is possible to provide a semiconductor device in which poor external appearance or lowering of adhesion to a cover can be prevented even when a sealing material is injected up to the vicinity of an upper surface of a casing. |
| 申请公布号 |
US2015279754(A1) |
申请公布日期 |
2015.10.01 |
| 申请号 |
US201514642695 |
申请日期 |
2015.03.09 |
| 申请人 |
FUJI ELECTRIC CO., LTD. |
发明人 |
SAEGUSA Naoki;KATSUKI Takashi |
| 分类号 |
H01L23/10;H01L23/057;H01L23/498;H01L23/053 |
主分类号 |
H01L23/10 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device comprising:
an insulating substrate; a semiconductor element which is mounted on the insulating substrate; a hollow casing which surrounds a peripheral edge of the insulating substrate to contain the semiconductor element therein; and a sealing material which is charged into the casing to seal the inside of the casing; wherein: the casing has a protrusion portion which protrudes partially from an upper surface of the casing. |
| 地址 |
Kawasaki-shi JP |
