发明名称 PARTICLE FREE ROTARY TARGET AND METHOD OF MANUFACTURING THEREOF
摘要 A rotatable sputter target configured for rotation around an axis defining an axial direction is described. The rotatable sputter target includes at least a first target segment and a second target segment forming a target, wherein at least one of opposing side surfaces of the first target segment and the second target segment are roughened, particularly to a surface roughness of 10 μm Rmax or above, more particularly of 100 μm Rmax or above
申请公布号 US2015279636(A1) 申请公布日期 2015.10.01
申请号 US201314434066 申请日期 2013.10.04
申请人 APPLIED MATERIALS, INC. 发明人 Hosokawa Aki
分类号 H01J37/34 主分类号 H01J37/34
代理机构 代理人
主权项 1. A rotatable sputter target configured for rotation around an axis defining an axial direction, comprising: at least a first target segment and a second target segment forming a target, wherein the first target segment has a first radially outer surface, a first radially inner surface and two first opposing side surfaces, wherein the second target segment has a second radially outer surface, a second radially inner surface and two second opposing side surfaces, wherein at least one side surface of the two first opposing side surfaces of the first target segment being provided adjacent to one further side surface of the two second opposing side surfaces of the second target segment has a surface roughness of 10 μm Rmax or above.
地址 Santa Clara, CA US