Provided is a component mounting device which enables the shortening of a mounting time between the supply of a component and the mounting of the component to an object with image pickup by an image pickup device performed therebetween. A component mounter moves a mounting head from a supply position (P1) to a mounting position (P3, P4) of a circuit board (CB) via an image pickup position (P2). Further, the component mounter performs control such that when passing the image pickup position (P2), the mounting head moves in an imager pickup-time movement direction that is either an X-axis direction or a Y-axis direction. The component mounter determines the image pickup-time movement direction according to a first X-axis distance (Lx) and a first Y-axis distance (Ly) between the image pickup position (P2) and the mounting position (P3, P4).
