WIRING FORMATION METHOD

摘要

This wiring formation method includes: a step in which metal nanoparticles or a metal paste are used and printed wiring is formed; and a step in which the surface of the printed wiring is treated using a surface treatment agent having a fluorine substituent. The surface treatment agent may also contain at least one functional group selected from a group comprising a thiol group, an alkoxysilane group, a trichlorosilane group, a phosphonic acid group, and a carboxylic acid group. The functional group in the surface treatment agent can bond to the surface of the printed wiring.