SEMICONDUCTOR PACKAGE ON WHICH SEMICONDUCTOR CHIP IS MOUNTED ON SUBSTRATE WITH WINDOW

摘要

The semiconductor package includes: a substrate having a window and first and second bond fingers arranged over a first surface along a periphery of the window; a first semiconductor chip disposed within the window and having a plurality of first bonding pads arranged over edges of an upper surface; a plurality of first connection members electrically coupling the first bonding pads with the first bonding fingers; a second semiconductor chip disposed over the first semiconductor chip and the first surface of the substrate and a plurality of second bonding pads in the edges of the lower surface; a plurality of second connection members electrically coupling the second bonding pads with the second bonding fingers of the substrate adjacent to the second bonding pads; and an encapsulation member formed over the first surface of the substrate to cover side surfaces of the second semiconductor chip.

主权项

1. A semiconductor package, comprising:
a substrate having a window in an inside portion and a plurality of first and second bond fingers arranged over a first surface along a periphery of the window; a first semiconductor chip disposed within the window and having a plurality of first bonding pads arranged over edges of an upper surface; a plurality of first connection members electrically coupling the first bonding pads with the first bonding fingers arranged adjacent to the first bonding pads; a second semiconductor chip disposed over the upper surface of the first semiconductor chip and the first surface of the substrate adjacent to the first semiconductor chip such that the first bonding pads and the first connection members are exposed, and having a plurality of second bonding pads arranged in the edges of the lower surface; a plurality of second connection members electrically coupling the second bonding pads with the second bonding fingers of the substrate arranged adjacent to the second bonding pads; and an encapsulation member formed over the first surface of the substrate to cover side surfaces of the second semiconductor chip and not an upper surface of the second semiconductor chip.