发明名称 COMPOSITION FOR FORMING SILICA-BASED INSULATING LAYER, METHOD FOR PREPARING COMPOSITION FOR FORMING SILICA-BASED INSULATING LAYER, SILICA-BASED INSULATING LAYER, AND METHOD FOR MANUFACTURING SILICA-BASED INSULATING LAYER
摘要 Disclosed is a composition for a silica-based insulation layer including hydrogenated polysilazane or hydrogenated polysiloxzane, wherein a concentration of a cyclic compound having a weight average molecular weight of less than 400 is less than or equal to 1,200 ppm. The composition for a silica-based insulation layer may reduce a thickness distribution during formation of a silica-based insulation layer, and thereby film defects after chemical mechanical polishing (CMP) during a semiconductor manufacturing process may be reduced.
申请公布号 US2015274980(A1) 申请公布日期 2015.10.01
申请号 US201314432401 申请日期 2013.08.16
申请人 CHEIL INDUSTRIES INC. 发明人 Yun Hui-Chan;Kwak Taek-Soo;Kim Mi-Young;Lim Sang-Hak;Han Kwen-Woo;Kim Go-Un;Kim Bong-Hwan;Kim Sang-Kyun;Na Yoong-Hee;Park Eun-Su;Bae Jin-Hee;Song Hyun-Ji;Lee Han-Song;Hong Seung-Hee
分类号 C09D1/00;H01L21/02;H01B3/02 主分类号 C09D1/00
代理机构 代理人
主权项 1. A composition for a silica-based insulation layer, the composition comprising: a hydrogenated polysilazane or a hydrogenated polysiloxazane, wherein a concentration of a cyclic compound having a weight average molecular weight of less than 400 in the composition is less than or equal to 1200 ppm.
地址 Gumi-si Gyeongsangbuk-do KR