发明名称 THERMOFORMABLE POLYMER THICK FILM TRANSPARENT CONDUCTOR WITH HAPTIC RESPONSE AND ITS USE IN CAPACITIVE SWITCH CIRCUITS
摘要 This invention is directed to a polymer thick film transparent conductive composition with haptic response capability that may be used in applications where thermoforming of the base substrate occurs, e.g., as in capacitive switches. Polycarbonate substrates are often used as the substrate and the polymer thick film conductive composition may be used without any barrier layer. Depending on the specific design, the thermoformable transparent conductor may be below or on top of a thermoformable silver conductor. Thermoformable electric circuits benefit from the presence of an encapsulant layer over the dried polymer thick film conductive composition. The electrical circuit is subsequently subjected to an injection molding process.
申请公布号 WO2015148263(A1) 申请公布日期 2015.10.01
申请号 WO2015US21483 申请日期 2015.03.19
申请人 E. I. DU PONT DE NEMOURS AND COMPANY 发明人 DORFMAN, JAY ROBERT;VOULTOS, JOHN D.
分类号 H01B1/22;C08L71/00;C08L75/04;H03K17/96;H05K1/09 主分类号 H01B1/22
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