| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a resin encapsulation mold for molding a semiconductor device from which a flash burr created on a rear face of a die pad can be easily removed.SOLUTION: In a semiconductor device manufacturing method using a resin encapsulation mold, a semiconductor chip 5 is die bonded on a die pad 3 and one end of a wire 6 is connected with an electrode pad on the semiconductor chip 5 and the other end of the wire 6 is connected with a lead 4. The lead is sandwiched by a resin encapsulation upper mold 8 and a resin encapsulation lower mold 1 and fixed, and a rear face of the die pad is pushed to a top face of the resin encapsulation lower die 1, that is, on a bottom face of an encapsulation area 11. A recess 2 is provided on a part of the top face of the resin encapsulation lower mold 1 and the die pad 3 is provided so as to completely cover the recess 2. When encapsulated with this composition, the resin injected into the encapsulation area 11 enters a gap between the die pad 3 and the resin encapsulation lower mold 1 but the entering resin forms a resin burr 14 at an edge of the recess 2 and the entry stops.</p> |
