HEAT-CONDUCTING LAMINATE FOR ELECTRONIC DEVICE

摘要

A heat-conducting laminate for an electronic device in which double-sided adhesive tape is affixed to at least one surface of a foam sheet having a 25% compression strength of 200 kPa or less and a thickness of 0.05-1.0 mm, the base material of the double-sided adhesive tape being polyethylene terephthalate measuring 2-100 µm in thickness.