发明名称 |
PASSAGE MEMBER AND SEMICONDUCTOR MODULE |
摘要 |
[Problem] To provide a passage member excellent in heat dissipating properties and a semiconductor module wherein a semiconductor element is mounted on a metal layer provided on the passage member. [Solution] A passage member (1), having a passage (2) through which fluid flows and which is formed as a space surrounded by a wall made of ceramic, wherein an area occupation ratio of the grain boundary phase at an inner surface (3a) of the wall portion where heat exchange takes place is smaller than an area occupation ratio of the grain boundary phase at an outer surface (3b). The passage member (1) configured as described above has excellent heat dissipating properties. |
申请公布号 |
WO2015147071(A1) |
申请公布日期 |
2015.10.01 |
申请号 |
WO2015JP59165 |
申请日期 |
2015.03.25 |
申请人 |
KYOCERA CORPORATION |
发明人 |
ISHIMINE,YUUSAKU;KOMATSUBARA,KENJI |
分类号 |
H01L23/373;C04B35/584;H01L23/473;H01L25/07;H01L25/18;H05K1/02 |
主分类号 |
H01L23/373 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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